By Steven H. Voldman(auth.), Steven H. Voldman(eds.)
ISBN-10: 0470979712
ISBN-13: 9780470979716
ISBN-10: 1118443322
ISBN-13: 9781118443323
Electrostatic discharge (ESD) keeps to affect semiconductor production, semiconductor elements and structures, as applied sciences scale from micro- to nano electronics. This bookintroduces the basics of ESD, electric overstress (EOS), electromagnetic interference (EMI), electromagnetic compatibility (EMC), and latchup, in addition to offers a coherent review of the semiconductor production atmosphere and the ultimate process meeting. It offers an illuminating look at the combination of ESD defense networks via examples in particular applied sciences, circuits, and chips.
The textual content is exclusive in overlaying semiconductor chip production concerns, ESD semiconductor chip layout, and approach difficulties faced this day in addition to the way forward for ESD phenomena and nano-technology.
Look inside of for wide assurance on:
- The basics of electrostatics, triboelectric charging, and the way they relate to provide day production environments of micro-electronics to nano-technology
- Semiconductor production dealing with and auditing processing to prevent ESD mess ups
- ESD, EOS, EMI, EMC, and latchup semiconductor part and procedure point checking out to illustrate product resilience from human physique version (HBM), transmission line pulse (TLP), charged equipment version (CDM), human steel version (HMM), cable discharge occasions (CDE), to procedure point IEC 61000-4-2 tests
- ESD on-chip layout and method production practices and options to enhance ESD semiconductor chip suggestions, additionally useful off-chip ESD defense and method point options to supply extra powerful systems
- System point matters in servers, laptops, disk drives, cellphones, electronic cameras, hand-held units, cars, and house applications
- Examples of ESD layout for cutting-edge applied sciences, together with CMOS, BiCMOS, SOI, bipolar expertise, excessive voltage CMOS (HVCMOS), RF CMOS, clever energy, magnetic recording expertise, micro-machines (MEMs) to nano-structures
ESD fundamentals: From Semiconductor production to Product Use enhances the author’s sequence of books on ESD defense. For these new to the sector, it's an important reference and an invaluable perception into the problems that confront smooth know-how as we input the Nano-electronic Era.
Content:
Chapter 1 basics of Electrostatics (pages 1–20):
Chapter 2 basics of producing and Electrostatics (pages 21–37):
Chapter three ESD, EOS, EMI, EMC and Latchup (pages 39–64):
Chapter four method point ESD (pages 65–95):
Chapter five part point matters – difficulties and recommendations (pages 97–127):
Chapter 6 ESD in structures – difficulties and options (pages 129–166):
Chapter 7 Electrostatic Discharge (ESD) sooner or later (pages 167–193):
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Additional info for ESD Basics: From Semiconductor Manufacturing to Product Use
Example text
1 Manufacturing Testing for Compliance Manufacturing test equipment is needed for evaluation of compliance to specifications. 4 Manufacturing test equipment DC Ohmmeter. Electrodes. Handheld Electrodes. Foot Electrode. AC Outlet Analyzer. AC Circuit Tester (Impedance Meter). Insulative Support Surface. Charged Plate Monitor. For all these items, it is necessary to verify the electrical measurements. In order to verify compliance, electrical measurements will be the means of determining an “ESD safe” environment, and compliance with objectives.
If the bond pad, or the solder ball/ bond pad structure is not connected to circuitry, the structure charges until the inter-level dielectric (ILD) insulator breaks down, causing cracks in the insulator. During humidity testing, these insulator cracks can lead to moisture entering the semiconductor chip. During ESD simulation testing, the “floating solder balls” were tested to the HBM test standard. In one technology, the ESD failures occurred at 1200 V HBM. 2). 4 MANUFACTURING MATERIALS The choice of ESD materials in a manufacturing environment can have a large effect on the ESD protected area (EPA).
11. H. (1983) Control implementation and cost avoidance analysis. Proceedings of the Electrical Overstress/Electrostatic Discharge (EOS/ESD) Symposium, pp. 6–11. 12. E. (1983) The production operator: Weak link or warrior in the ESD battle? Proceedings of the Electrical Overstress/Electrostatic Discharge (EOS/ESD) Symposium, pp. 12–16. 13. T. (1984) A realistic and systematic ESD control plan. Proceedings of the Electrical Overstress/Electrostatic Discharge (EOS/ESD) Symposium, pp. 1–6. 14. T. S.
ESD Basics: From Semiconductor Manufacturing to Product Use by Steven H. Voldman(auth.), Steven H. Voldman(eds.)
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